Reconfigurable. The XChange3031 delivers full wire-speed across all of its ports and supports jumbo frames up to 10 kB. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms. COOLING EMBEDDED VME AND VPX SYSTEMS. Available for use in either AC or DC systems, they are 6U high by 5HP (1-inch) wide modules with guide blocks, for use in VPX systems. EIZO. ENHANCE THE PERFORMANCE & RELIABILITY OF YOUR SYSTEM WITH ONE DESIGN DECISION. The AoC3U-400 Series of chassis use leading edge technology to manage high heat dissipating board payloads. WOLF’s 3U VPX modules use the 1" pitch allowed in VITA 48 (VPX REDI). Works With: Subracks; Cases. The VPX base standard defined in VITA 46 is a scalable module and backplane technology designed specifically for high speed, critical embedded systems. The Condor GR4-RTX3000 is a rugged 3U VPX form factor card based on NVIDIA® Turing™ architecture and the NVIDIA RTX™ platform. This system supports standard SBC and switch modules, as well as VITA 67 modules, making it the ideal platform for high-performance RF applications. August 2021 – Norristown, PA – LCR Embedded Systems has released two new conduction cooled chassis for high speed VPX systems. Pictured above (from top counter-clockwise) : Acromag VPX4810 PMC/XMC carrier card in air-cooled, conduction-cooled, and VPX-REDI formats. SE306S-CCVPX- Conduction 6 SSD XMC Yes 6 GB/s 12TB No StoreEngine 3U Air Cooled VPX SE300‐VPX‐ND accomodates standard I/O XMCs StoreEngine 3U Conduction Cooled VPX SE300‐CCVPX‐ND accomodates standard I/O XMCs via a removable front panel/heat frame element StoreEngine 3U Air Cooled VPXThe VPX CUBE features 4 slots of 3U VPX on a 1″ pitch high bandwidth backplane and an integrated, wide temperature range 400 Watt power supply. Conduction-Cooled Option. Related links and. High Performance Embedded Computing. The high-performance VX305C-40G is available in both air-cooled (for lab or other benign deployed environments) and conduction-cooled Plug-in units as per VITA 48. PXI Express Chassis Systems. pitch without solder-side cover; 0. The D575. 2 struggles to dissipate the attendant heat using straight conduction cooling – leaving system designers with only two choices; move to VITA REDI alternatives or stick with VITA 48. Usually the test adapter includes fields for voltage and amp, current measurements and in some cases also some pins for wire wrap to conduct custom. The XPand1508 supports two standard VITA 46. Sarsen Technology supports a range of high performance computer graphics hardware based on NVIDIA and AMD technology for applications including GPGPU computing, video capture and processing, Artificial Intelligence (AI), and data archiving. However, as module power continues to increase, VITA 48. 950 inch Standard Conduction Cooled VITA Card in SOLIDWORKS. 3. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. Single-slot 6U VPX form factor Dimensions: 233 mm x 160 mm x 25. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. Options for discrete controlled military secure erase. -No. 1/2 ATR, conduction-convection cooled. 2) modules. Operating Temperature: -40C to +85C. Single Slot 3U VPX Board Features • Largest available capacity in a single 3U VPX slot with dual SATA drives o Compliant with OpenVPXTM (VITA 65). Combine various standard components to create a Wedge Lok that satisfies your requirements. Convection (air) and conduction with extended temps. pitch conduction-cooled VPX (VITA 48. Kontron's selection of VPX switches includes fully managed 10 Gigabit Ethernet switching and up to 28 ports Gigabit Ethernet switching. The panels on both the front and rear slots are removable for ease of probing and debugging. 2 / VPX conduction cooled thermal load board module. Conduction cold plates with enhanced material conductivity such as Thermacore’s k-core APG and heat pipe cold plates in the VPX format can be used to design electronic systems with power levels above that possible with pure aluminum cold plates, but can still rely on conduction cooling rather than utilizing active systems such as forced. The new cooling standard defines design requirements for platforms that need high performance processing, graphics. Creation of a specific board-cage to integrate conduction cooled VPX boards into a ventilated chassis. Fax: (604) 875-5867. VStream-VPX Datasheet Order Enquiry for VStream-VPX. Output over-voltage, over-current, and over-temperature. Conduction-cooled, rugged 3U VPX form factor. Item/Part Number: 1940000376-0000R Product Features. (604) 875-4405. 3U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. The chassis combines forced air with conduction cooling to dramatically increase thermal. With a total of six high-performance Gigabit Ethernet interfaces (2 routed, 4 switched), the 3U conduction-cooled (VITA 48. The VPX Timing Clock offers a complete solution set for all PNT needs. VPX is an ANSI standard that facilitates efficient upgrade to switched fabric technology for the sizeable existing base of VMEbus users, bringing them up to the task of supporting multiprocessing systems that demand the fastest possible communication capabilities. 3 V. See the Rugged section for more details. 6U VPX air cooled as per VITA 62, front Panel with Extractor handle, 160 mm deep. Advanced. Integrated security features for reliable, secure data transmission. Kontron's selection of VPX switches includes fully managed 10 Gigabit Ethernet switching and up to 28 ports Gigabit Ethernet switching. 8, air flow-through cooling without sealing for small form factor 3U and 6U VPX modules, (ANSI. The DK3 for 3U VPX features an open frame concept and enhanced flexibility, with fast conversion between air and conduction cooled module guides. 0 standard by specifying additional mechanical details related to the frame construction of conduction-cooled modules. The XPort3305 is a conduction-cooled dual 10 Gigabit Ethernet XMC with front and rear panel I/O support. 2 extraction levers and performance wedge locks • 3X - Samtec HQDP connectors for 1G. The WILDSTAR 3XV7 integrates Xilinx's new Versal™ Premium VP1502 or VP1702 FPGA. The Chassis Manager is VITA 46. 2 chassis, heat is conducted away from hot module components through the heat sink and out to the module wedge locks. PSC-6236 Product Datasheet. VPX6860: 6U AcroExpress OpenVPX SBC Air or Conduction-Cooled Features & Benefits. 3 to the P15 connector for interfacing with the host module. WOLF carrier boards are designed to provide system designers with a flexible, highly configurable PCI Express interface. The XPedite5570 supports up to 8 GB of up to DDR3-800 ECC SDRAM, as well as up to 32 GB of NAND flash and up to 512 MB of NOR flash (with redundancy). 3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules. Intel® Xeon® D-1700 Processor-Based Rugged. It provides guidelines for constructing the frame, which is an essential part of the conduction-cooled module’s thermal. pitch air-cooled VPX (VITA 48. Conduction-Cooled Option. Eight 6U VITA 48. The logic-optimized FPGA is well-suited for a. 0 in. XIt1086 (90040055) - 3U VPX Rear Transition Module with PCIe, 10 Gigabit Ethernet, eSATA, USB, Serial, and Expandable XIM Sites; XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O; XPand1200 (90070530) - 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules The XPedite7672 is a secure, high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D-1500 family processors. 2. 0-inch pitch • Meets VITA58 specification with multiple sizes availableCooling. 125 Gb/sec. A momentary push button is provided for reset, and a switch is. Form Factor: 3U VPX Ethernet: 4 10/100/1000BASE-T USB: 2 USB 2. It provides 550 W of total simultaneous power, which can be distributed as up to 8 A on 12 V, up to 80 A on 5. 2 conduction cooled 6U VPX module with 1 inch pitch : • 6Ux160mm form factor as defined by IEEE 1101. 5” front panel with Hercules ® high-speed, ruggedized, circular mil connectors allows customization to exact application requirements. The logic-optimized FPGA is well-suited. It supports up to two 0. 85" or 1. 85 and 1. 3U VPX Board - 1 x8, 2 x4, 4 x2 PCIe. Expansion Plane. Part of our 1400 Series of conduction cooled enclosures with air assist, the 1440 is designed to maintain safe operating temperatures for high slot count 3U VPX systems and may be used as a deployment or development chassis. The XPand1015 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. Power and reset LEDs are provided for system status. The XChange3030 is a conduction-cooled 3U VPX Ethernet switch module. It features a FMC+ slot. Search for: Products. 3A/37A (normal/peak inrush current)performance leaps relative to VME and early VPX systems of just a few years ago. Our expertise also includes VITA 66, VITA. 8 in. pitch conduction-cooled VPX (VITA 48. or 1. Mechanical Specifications for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX: This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility. NXP (formerly Freescale) QorIQ T2080 Processor-Based Conduction- or Air-Cooled 3U VPX Single Board Computer (SBC) The XPedite5970 provides a rugged, feature-rich processing solution that maximizes the performance-per-watt capabilities of a Power Architecture®-based processor module. This emerging family of ATR chassis is designed to maintain safe operating temperatures for. The XChange3012 supports an. 2 mechanicalformat. Form Factor: Custom Chassis Type: Custom. Revolutionary design allows for up to 175 watts per slot of conduction cooling. 2 (REDI) and VITA 65 (OpenVPX™). 3U VPX – OpenVPX Backplanes3U VPX rugged ATR chassis systems supporting up to six modules, designed to meet the rigorous standards of MIL-STD-810F/G and DO-160. 125 Gb/sec. Designed for COTS applications this Intel SBC utilizes the Intel C230 series PCH chipset for extensive I/O support. Conduction-Cooled 3U VPX-REDI XMC Carrier Card. ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. The DCMs pro-vides RF to IF conversion (where necessary), pre-selection, and gain equalization. 5” front panel with Hercules ® high-speed, ruggedized, circular mil connectors allows customization to exact application requirements. The XPedite2470 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the Xilinx Virtex-7 family of FPGAs. Conduction- or Air-Cooled 3U VPX-REDI XMC/PMC Carrier Card. . VPX and SOSA aligned slots may support VITA 66 and. Integrated Conduction Cooled Assembly Designed for rugged conduction cooled assemblies (CCAs) in VPX systems, the High Thermal Integrated CCA design innovatively. VMEbus International Trade Association, 2010. The chassis is designed for plug in cards in alignment with the SOSA technical standard. High performance 3U or 6U single board computers feature air or conduction-cooled options. 2 -40°C to 85°C (Rugged Conduction Cooled)Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1. It supports 3rd Gen Intel Core series processor and Intel QM77 chipset. 2 * DDR4 banks (up to 4GB each) The IC-FEP-VPX3d is a 3U VPX FPGA processing board based on a Kintex® UltraScale™ FPGA (KU060, KU085 or KU115). Both XMC and PrPMC interfaces are active simultaneously. The XPand1010’s design eliminates card cages, rear transition modules, and large noisy fans. Intel Xeon Quad Core Xeon E3-1505M V5 (47W) Intel C230 series CM236 PCH chipset; Up to -40 to 85°C extended operating range; Programmable CPU power for heat sensitive apps. 1” Pitch (Conduction Cooled) 0. Frame has injector/ejector latches for plug-in card. 1x 100GBase-KR4, 1x 10/25GBase-KR. VITA 48. The 3U VPX backplane uses standard 1. The modules can be easily tailored to suit individual requirements,VPX Test Adapter. 0 in. 2 Type 2, Secondary Side Retainer. The AcroExpress ® VPX6600 is a high-performance 3U OpenVPX TM embedded single board computer based on the 6th Generation Skylake Intel ® Xeon ® E processor and PCH. Boards are inserted in the back of the chassis in a vertical orientation. or 1. The XPedite7770 is a secure, high-performance single board computer based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors, making it an optimal choice for computationally heavy applications requiring. Conduction cold plates with enhanced material conductivity such as Thermacore’s k-core APG and heat pipe cold plates in the VPX format can be used to design electronic systems with power levels above that possible with pure aluminum cold plates, but can still rely on conduction. Systems Integration Plus, Inc. A comprehensive 3U VPX product portfolio of PICs aligned with CMOSS and SOSA technical standards such as SDR, DSP, SBC, networking, communication, and PNT. 3 V @ 9 mA to 60 mA) Conduction Cooled: MMCX Jack (+3. Real-time video feedback for remote platforms ; Unmanned vehicles (UAV, ROV) Real-time IP video distribution. Conduction-Cooled XMC with Dual 10 Gigabit Ethernet Interfaces and Rugged Optical Connector. 5” (Other slot arrangements on request) Interchangeable front card guides for convection or conduction cooled cards; NEW: Card guides for VPX-REDI VITA 48. While air and conduction cooling are often implemented to address cooling challenges, liquid cooling solutions can be effective for designs at the chassis,. AoC3U-210: air over conduction cooled 2 slot 3U VPX ATR chassis for 3U VPX and SOSA aligned plug in card payloads. The VPX3-663 combines a PCIe Gen 3. Abaco Announces Production of. 0 in. View product. Conduction cooling is defined as the transfer of heat through solids. Products. 1-2201-compliant conduction-cooled 3UVPX carrier card . Form Factor: 3U VPX Ethernet: 2 10GBASE-T, 4 10/100/1000BASE-T USB: 2 USB 2. Hartmann Electronic VPX Standard Chassis are designed to allow any COTS or customer spec configuration in either 3U or 6U form factor taking into account a wide range of. 8 in. The development systems use Concurrent Technologies' commercial off the shelf boards which are also available as rugged conduction cooled, VPX-REDI boards ensuring that applications which are produced on the development Systems can be easily progressed to a ruggedized implementation. StoreEngine™ VPX is a 3U or 6U VPX (air or conduction cooled) slot storage server which can simultaneously serve block data (like a disk drive or RAID system), serve file data (like a NFS/CIFS file server), and simultaneously operate as a high speed data recorder. 2 struggles to dissipate the attendant heat using straight conduction cooling – leaving system designers with only two choices; move to VITA REDI. 0 in. The XChange3000 provides easy integration of standard mezzanine cards into modern VPX backplanes. 6U/ 5HP VPX load card, conduction cooled. Configure your PCB Wedge Lok. These Single Board Computers from X-ES are available in air-cooled and conduction-cooled versions to support a wide variety of. However, as module power continues to increase, VITA 48. 5-3- Two 4-lane PCIe fabric ports Power <15W Linux ® and WindRiver VxWorks BSPs Pin compatible with VPX3-131, VPX3-133 and VPX3-1257 Designed for harsh environment applications, both air-cooled and conduction-cooled Introduction Curtiss-Wright Defense Solutions' VPX3-This development chassis enables shortened design cycles for faster time to deployment. Part of our AoC3U-400 Series of rugged packaging solutions, the AoC3U-400 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VPX and SOSA aligned conduction cooled systems. Block Diagram. or 1. AoC3U-410 Conduction Cooling with Air Assist. 3U Switch. (H) Four 0. 3U OpenVPX (VITA65) conduction cooled form factor; Applications. . 3U VPX Rugged conduction-cooled Processor Board; Up to 6 -core Intel ® Xeon ® E-2276ME processor; Up to 32 Gbytes DRAM with built in error correction;. Open Frame Reduces System Design Time. The XPedite7672 is an optimal choice for computationally heavy applications. Rugged 3U VPX graphics & GPGPU card based on the NVIDIA Turing architecture using the NVIDIA Quadro RTX 5000 GPU with single-link DVI and DisplayPort™++ outputs. Physical Characteristics. The high-density components that enable high-speed I/O also use more power, making advanced cooling methods essential for rugged VPX designs. It supports up to two 0. Both are designed to support a minimum of ten 0. 9"L x 5. The XChange3031 is a conduction-cooled 3U VPX Ethernet switch module. Mobile workstation processor performance with enterprise-VPX Meritec Cable Module (Odd or Even) Daughter Card for Host board (Air or Conduction cooled). Motorola – Single board chassis design with natural convection requirement. It supports up to two 0. The carrier card routes power and bus signals to a plug-in mezzanine module through the VPX card slot connector. Secondary Side Wedge lock conduction cooled. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. 2, “Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX”, developed by VITA, defines the mechanical requirements that are needed to ensure the mechanical interchangeability of air-cooled 3U and 6U plug-in units and define the features required to achieve two level maintenance compatibility. View. 8 in. Embedded RuSH TM technology. The entire liquid conduction cooled chassis is built at our Longmont facility. N/A. VPX Carrier Cards Bulletin #8400-626i Air-cooled, conduction-cooled and REDI versions 3U One PMC/XMC slot PCIe x8 Gen 2 interface VPX4810 VPX Carrier Cards for XMC or PMC Modules Conduction-cooled version VPX REDI VITA 48 version P2 PCIe x4 PCIe x8 PCIx 64-bit PMC I/O PMC/XMC Site P1 Port A PCIe x8 PCIe Switch PCIx to PCIe Bridge. PUMA 2509 is an industry standard VITA 62 conduction cooled through wedgelock, VPX power supply. 2 conduction cooled modules. The 7-slot air-cooled Chassis and Backplane incorporates slots for up to four conduction-cooled 3U VPX Payload Boards, plus a 100GbE Switch, SBC, and VITA 62 power supply, delivering up to 700W. Hartmann Electronic VPX Standard Chassis are designed to allow any. VITA 62 3U 400W AC/DC VPX power supply; Universal AC Input: Single Phase, 85-264VAC, 47-400Hz;Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. Aids in locating hot spots in the chassis. Quick. Both XMC and PrPMC interfaces are active simultaneously. Eight 6U VITA 48. 8” Pitch (Conduction Cooled) VPX & PCIe Graphics Processor Operating Temperature (MIL-STD-810) NVIDIA Quadro RTX 3000 GPU (TU106 Turing Architecture) -40°C to 70°C (Rugged Air Cooled) Supporting DirectX 12, OpenGL 4. 8 in. or 1. It supports up to two 0. 8-inch and/or 1. The logic-optimized FPGA is well. The. The XPedite7477 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor and Intel® QM67 chipset. Product Features. The 53xxx Series mounts one XMC module on a 3U VPX carrier with a flexible crossbar switch. CCE-3VX4 Conduction Cooled Enclosure for 3U Modules › 4 slots of 3U VPX on 1" pitch (Open VPX Ready) › Integrated power supply › RuSH enhanced power supply actively monitors: – Voltage on each power rail – Current on each power rail – Temperature (humidity – optional) › FFM-overlay backplane interconnection for quick turn˚Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. VPX6860: 6U AcroExpress OpenVPX SBC Air or Conduction-Cooled Description. Select one of the products below to see specifications and learn more. The XPand1011 system is a low-cost development platform for conduction-cooled 6U VPX cards. In its default configuration, the XPand6200 Series Development Kit includes the XPand1508 I/O breakout stations. The XPand1303 is a low-cost, flexible, development platform. Form Factor: 6U VPX Chassis Type: Development Number of Slots: 2 Dimensions: 17. One Payload and remaining Peripheral Slots (with Switch slot option) High Speed fans with 1U Tray at the bottom. Abaco’s SBC3612D rugged 3U VPX single board computer delivers the highest performance you can get in a 3U Intel® base. 4 mm Compliant with the VITA 78 SpaceVPX standard For lab variant: Air-cooled metals For flight variant: Conduction-cooled metals Up to 12 Rx/Tx mid-board fiber transceivers System Manager FPGA For lab variant: ACT-H3KI-CG624: ProASIC3: A3PE3000-2FG896iPCI-SYSTEMS Inc. 8-2017, “Mechanical Standard for Electronic VPX Plug-in Modules Using Air Flow Through Cooling” was developed and promoted by a working group sponsored by Lockheed Martin,. Software. 3U VPX, 6U VPX, and OpenVPX-based SBCs, I/O, storage, switches, rugged systems, and development platforms featuring Intel Core i7, Intel Xeon D, & Freescale QorIQ T-Series and P-Series processor technology. X-ES provides 3U VPX Single Board Computers based on the latest Intel® and NXP (formerly Freescale) QorIQ processors. 0 and VITA 65 connector interoperability. Ports: OpenVPX 3U Switch slot profile: SLT3-SWH-2F24U-14. Block Diagram. 3U CompactPCI 2. Ethernet Features Built around a non-blocking core fabric, the VPX3-652 supports a wide range of network features, including:Files (3) VPX VITA CARD 3U /. Spare Power Supplies for W-IE-NE-R NIM and CAMAC chassis, providing high power density and low ripple and noise. Most VPX systems use VITA 48. Trident offers a wide range of ATR chassis that are convection, conduction cooled, forced air conduction cooled and liquid cooled. Development chassis for VPX and SOSA aligned module payloads. or 1. 6U Board with aluminum heatsink. The PX3030 is a conduction-cooled single-board computer offering an industry-leading combination of processing power and functionality in a 3U VPX-REDI module. Documentation. Up to 32GB of high-speed. 6-Slots of 3U VPX with integral 6-channel intelligent 400W power supply. Fast backplane replacement makes for easy reconfiguration in support of every stage of development. Fast backplane replacement makes. nVent SCHROFF offers you a wide range of Card Lok, Conduction Cooling and VPX Chassis. or 1. Innovative Integration recommends that all electronic assemblies and components circuits be handled with appropriate precautions. 8 in. Compare. It is available in air-cooled and conduction-cooled versions. 65 in. WILDSTAR 3XV7 3U OpenVPX FPGA Processor – WB3XV7. The VPX enclosures come in 1U-4U horizontal-mount (for 3U boards, 6U boards, or a mix), 4U-6U vertical-mount (for 3U cards), and 7U, 9U, and higher chassis (for 6U OpenVPX boards). 3 to the P15 connector for interfacing with the host module. GHz wideband converter is a SOSA-aligned, conduction cooled, VPX RF Payload Card, which provides one channel up, one channel down, and a synthesizer in a single, 3U slice. 8 in. 0, 2. 30 in. Extremely robust, bullet proof design ♦ Fully integrated power supply, backplane, I/O in one box ♦ 4-Slots of 3u VPX on 1” pitch (OpenVPX Ready) ♦ Full environmental sealing per DO-160E ♦ Vita 48. Compare. Cooling air flows directly over the board. Best Application: Where shock, vibration, and air contaminants are not an issue. Conduction cooled version: -40°C to +75°C at wedge locks (+85°C optional) Air cooled version: -40°C to +75°C Storage Temp. 3U VPX Embedded SBCs offering unparalleled performance from cutting-edge Intel or NXP (Freescale) processors & features like integrated FPGAs & SecureCOTS™. 1. 3U conduction-cooled VPX Ethernet router. 00" pitch. The liquid-cooled chassis sidewalls will. ANSI/VITA Stabilized. 3 Up to 24x 10 GETH. This 3U Module enables an isolated thermal path Air Flow Through (AFT) – ANSI/VITA 48. This platform supports up to eight 0. NXP QorIQ T2080 Processor-Based Conduction- or Air-Cooled 3U VPX SBC. VITA 48. A common example of this is the conduction cooled chassis mounted onto a cold plate as shown in the below figure. Length: 160 mm. This 3U VPX payload slot module can be used to extend the PCIe bus to any other PCIe based. Shock: 40G peak for conduction-cooled; Dimensions: 160mm x 100mm x 25. VITA 67. It can. High-Performance 3U VPX Connectivity. 2) VPX router serves as an aggregation point for on-demand network connectivity in mobile or fixed deployments. Learn more about this product below »XMC Module | Conduction- or Air-Cooled. pitch air-cooled VPX (VITA 48. Part of our line of conduction cooled enclosures with air assist, the AoC3U-1400 is designed to maintain safe operating temperatures for high slot. Air-cooled, conduction-cooled and REDI versions; 3U Single XMC slot; PCIe x8 Gen 2 interface; The VPX4812A can be used as a VPX switch card allowing a host CPU to communicate with up to 3 downstream cards in addition to the XMC card. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. Concurrent Technologies. NIM / CAMAC Power Supplies. These 3U VPX boards are delivered with full artifact packages to reduce the risk, cost, and development time required to reach certification. Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules. Read the full article hereHartmann’s VPX Power Supplies are built for the most rugged applications with quality and reliability in mind. It features dual 9 slot backplanes including PSU slots. 6-slot, 3U OpenVPX (VITA 65) backplane, 1-in pitch. This forced-air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810F/G while integrating the latest power-saving and performance-enhancing technology. • Rugged VPX systems where thermal performance is a concern • Options for second level maintenance APPLICATIONS • Meets VITA 48. 3U VPX-REDI conduction- or air-cooled form factor; Dimensions: 100 mm x 160 mm; 0. 35mm X 160mm] for circuit Boards & plug-in units with AIR or Conduction cool mechanism The base Mechanical specifications of PCB & Plug-In units are defined by VITA46 The Allowable Standoff Height for PMC/XMC is 10mm where 0. This highly ruggedized conduction cooled unit provides a versatile multifunction clock references for any environment. Conforms to VITA 46 VPX specifications. 350 W VITA 62 PSU-Conduction Cooled. 8 in. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules. 8 GHz) with 96 EU Intel® Iris® Xe Graphics48. SATA, PCIe, and NVMe interfaces. 2 / VPX conduction cooled thermal load board module. The Chassis CPU will monitor and maintain the VPX module wedge. VPX-TF3090 3U VPX conduction cooled test frame with tBP-VPX3000. 3U Air cooled models available in 1. VITA 48. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. The IC-INT-VPX3e is a powerful OpenVPX 3U Single Board Computer (SBC) based on the Broadwell-DE processor – 14nm High Performance Chip of Intel’s Low Power Spectrum. 1 PICMG 2. VPX Backplane, 3 U, 5 Slots, Full-Mesh, Without RTM. pitch conduction-cooled VPX (VITA 48. See the Rugged section for more details. or electronic warfare capabilities, which means that AFT-cooled plug-in VPX modules – including both 3U and 6U form factors – retains the current VITA 46. 11(draft) System Management on VPX VITA 48. VX3060-S2 Rugged Conduction cooled version is a Plug-in unit according to VITA 48. The XPedite8171 is an Intel® Atom™ E3800-based 3U VPX-REDI single board computer available in conduction- and air-cooled configurations. Higher conduction means lower component temperatures . These 3U AC supplies boast a 600W air-cooled design with an internal fan and up to 88% efficiency. The XChange3031 delivers full wire-speed across all of its ports and supports jumbo frames up to 10 kB. The 3U VPX XMC Carrier is a rugged conduction cooled single slot 3U VPX XMC Carrier that can connect one XMC module to a standard VPX backplane using PCIexpress 1x 8lane or 2x4 lane configurations. Three tri-color front panel LED’s to. Trident’s rugged small form factor (SFF) commercially off the shelf (COTS) embedded computer is designed for harsh environments of military, aerospace and heavy industries and addresses the challenging need for many space constrained applications in avionics, aerospace and defense industries. pitch with Two-Level Maintenance (2LM) support; Environmental Requirements. 2 applies to 3U and 6U VPX embedded computing modules, and defines the dimensions of plug-in units for conduction-cooled applications and connector-mounting details, as well as key sub. This allows testing of the conduction cooled modules without going through the thermal chamber. 1 compliant products to extend the temperature range of operation to drive the costs down To keep the weight low to avoid the use of other less cost effective solutions based for instance on the VITA 48. The rugged. 59"L x 4. Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or 3U cPCI modules designed and manufactured by X-ES. FPGA Resources. 1 ATR platform with liquid cooled side walls, 6U conduction cooled boards, 1” pitch, per VITA 48. 2 conduction cooled modules and VITA 67. (0°C to +55°C) and conduction-cooled version (-40°C to + 85°C). Description. 2-2020: Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VPX; This Standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two. These Single Board Computers from X-ES are available in air-cooled and conduction-cooled versions to support a wide variety of applications across multiple industries. Today ATR’s are introduced into applications imagined never before, including surveillance, data collection, storage and weapons control. Ethernet. The XPand1202 provides a low-cost, flexible, VITA 67 development platform. Transfer rates up to 3940 MB/s. or 1. Combine various standard components to create a Wedge Lok that satisfies your requirements. Talk to a Hartmann representative today about compliance and your power needs. [email protected] Single Board Computer. 2 conduction-cooled modules due to an established deployment track record. 625 IN : Model Number:2. conduction cooling. pitch slots and built in accordance. TR E8x/msd-RCx – Rugged 3U VPX Processor. 3U VPX Development Platform for Up to Eight Conduction-Cooled Modules. Download. Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms. This enables the VX305H-40G to sustain 70°C card edge temperature according to VITA 47 XMC support.